Hui S. C. M.,
1997. Overall thermal transfer value (OTTV): how to improve
its control in Hong Kong, In Proceedings of the One-day
Symposium on Building, Energy and Environment, 16
October 1997, Shangri-la Hotel, Kowloon, Hong Kong, HKIE BS
Division/CIBSE/ASHRAE/PolyU, p. 12-1 to 12-11. http://ibse.hk/cmhui/bse97a.pdf
Building envelope
design - Case study: HSBC Headquarters Building
Burberry
P., 1997. Environment and Services, 8th ed.,
Longman. [HKALL]
Knaack U. &
Klein T., 2008. The Future Envelope 2: Architecture,
Climate, Skin, IOS Press, Amsterdam, The Netherlands.
[HKALL]
Knaack U. &
Klein T., 2008. The Future Envelope 1: A
Multidisciplinary Approach, IOS Press, Amsterdam, The
Netherlands. [HKALL]
Knaack U. &
Koenders E. A. B., 2018. Building Physics of the
Envelope: Principles of Construction, Ebook Central. [HKALL]
Szokolay S. V.,
2014. Introduction to Architectural Science: the Basis
of Sustainable Design, Third edition, Routledge,
Abingdon, Oxon and New York, NY. [HKALL]
Zaera-Polo A.
& Anderson J., 2021. The Ecologies of the Building
Envelope: A Material History and Theory of Architectural
Surfaces, Actar D. [HKALL]